Semiconductor integrated circuit

Details Semiconductor integrated circuit Semiconductor integrated circuit

2009-02-27

2011-10-25

Dang, Phuc (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257SE23142, C333S246000

Reexamination Certificate

active

08044514

ABSTRACT:
In a semiconductor integrated circuit, a second wiring layer includes a ground conductor having at least one opening formed therein. At least one opening is overlapped by at least one patch conductor included in a third wiring layer. At least one patch conductor and the ground conductor are electrically connected to each other by at least one via hole included in a second dielectric layer. A first wiring layer includes a signal line above the ground conductor.

REFERENCES:
patent: 6967557 (2005-11-01), Hagios et al.
patent: 7094624 (2006-08-01), Park et al.
patent: 7217370 (2007-05-01), Sugimoto et al.
patent: 7973245 (2011-07-01), Muramatsu et al.
patent: 2004/0211590 (2004-10-01), Tagi et al.
patent: 2009/0079523 (2009-03-01), Hsu
patent: 4-291803 (1992-10-01), None

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