Solid-state image pickup device and electronic instruments

Details Solid-state image pickup device and electronic instruments Solid-state image pickup device and electronic instruments

2009-04-29

2011-11-01

Ho, Tuan (Department: 2622)

Television

Camera, system and detail

Optics

Reexamination Certificate

active

08049809

ABSTRACT:
A solid-state image pickup device which includes a circuit board provided with a hole and with a circuit layer formed thereon, a solid-state image pickup element housed in the hole and having an upper surface constituting a light-receiving face and electrodes formed on a peripheral portion of the upper surface, and a glass plate disposed over the light-receiving face and provided with a connecting conductive layer which is extended from the underside of the glass plate, via the sidewall of the glass plate, to the upper surface of the glass plate. The electrode is electrically connected with the connecting conductive layer formed on the underside of glass plate, and the connecting conductive layer is electrically connected with the circuit layer formed on the upper surface of the circuit board.

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International Search Report for International Application PCT/JP2007/071678, mailed Jan. 15, 2008.
Korean Office Action mailed Aug. 26, 2010 in the corresponding Korean patent Application No. 10-2009-70097700.
English Translation of the International Preliminary Report on Patentability mailed Jun. 4, 2009 in corresponding International Patent Application PCT/JP2007/071678.

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