Method for making a schottky diode that is compatible with high

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Schottky barrier to polycrystalline semiconductor material

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257477, 257484, 257486, 257510, 257515, 257755, 257757, 257764, 257765, 257770, 257771, 437 39, 437 63, 437 78, 437175, 437178, 437189, 437197, 437200, 437203, 437228, H01L 2904, H01L 21265

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055833489

ABSTRACT:
A method for making a schottky diode structure (10) simultaneously with a polysilicon contact structure (31,33) to a transistor is provided. In a single process step, a polysilicon layer is patterned to expose a single crystal semiconductor region (22a) over one portion of a substrate, while leaving portions the polysilicon layer (31, 33, 29) intact over other portions of the substrate (22b). Multi-layer metal electrodes are deposited and patterned to form a rectifying schottky contact to the exposed single crystal region (22a), and to form an ohmic contact to the exposed polysilicon (31, 33, 29).

REFERENCES:
patent: 4278985 (1981-07-01), Stobbs
patent: 4860065 (1989-08-01), Koyama
patent: 4862244 (1989-08-01), Yamagishi
patent: 4956688 (1990-09-01), Honma et al.
patent: 5140383 (1992-08-01), Morris et al.
patent: 5144404 (1992-09-01), Iranmanesh et al.

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