Epoxy resin composition and semiconductor device

Details Epoxy resin composition and semiconductor device Epoxy resin composition and semiconductor device

2005-07-28

2011-12-27

Heincer, Liam (Department: 1767)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

C524S437000

Reexamination Certificate

active

08084520

ABSTRACT:
An epoxy resin composition comprising (A) an epoxy resin (B) a phenol resin, (C) a curing accelerator, (D) silica, and (E) alumina and/or aluminum hydroxide, wherein the amount of aluminum to the total amount of the epoxy resin composition is 0.25-5 wt % and 70 wt % or more of the silica has an average particle size of 25 μm or less. The epoxy resin composition for semiconductor encapsulating and a semiconductor device comprising a semiconductor element encapsulated using the composition possess excellent characteristics in reliability during high temperature operation.

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