Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing
Reexamination Certificate
2009-02-12
2011-11-08
Jarrett, Ryan (Department: 2121)
Data processing: generic control systems or specific application
Specific application, apparatus or process
Product assembly or manufacturing
C700S175000
Reexamination Certificate
active
08055374
ABSTRACT:
A machining quality judging method for a wafer grinding machine and wafer grinding machine are disclosed. The thickness of a wafer2is acquired from the feed amount of a grinding unit3while at the same time actually measuring the thickness of the wafer2appropriately. The wafer grinding machine includes a machining quality judging unit20for comparing the thickness of the wafer2based on the feed amount of the grinding unit3with the actually measured thickness of the wafer2and judges the machining quality of the ground surface of the wafer2. Upon judgment of a machining failure, a command is issued to stop the back surface grinding operation.
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Christie Parker & Hale, LLP.
Jarrett Ryan
Rapp Chad
Tokyo Seimitsu Co. Ltd.
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