Device assembly structure with reinforced outer leads

Details Device assembly structure with reinforced outer leads Device assembly structure with reinforced outer leads

1996-09-12

1999-03-02

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With means for controlling lead tension

257668, 257779, H01L 23495, H01L 2348

Patent

active

058775439

ABSTRACT:
A highly reliable assembly structure is provided by surely reducing a stress to be exerted on leads of a TCP device. Part of a soldered portion of outer leads that is located closer to a semiconductor chip of the TCP device is reinforced by a support ring formed on a side of the outer leads opposite from a circuit board, so that a stress to be exerted on the outer leads is dispersed to the leads, the support ring and solder to thereby prevent the possible occurrence of metal fatigue of the leads.

REFERENCES:
patent: 5107325 (1992-04-01), Nakayoshi
patent: 5390079 (1995-02-01), Aomori et al.
patent: 5478006 (1995-12-01), Taguchi
patent: 5528077 (1996-06-01), Tane et al.
patent: 5659198 (1997-08-01), Okutomo et al.
Translation of relevant parts of German Patent No. DE-A-4429004 listed as Reference BA on form PTO-1449 submitted Apr. 15, 1997.
E.H. Newcombe, III, "Design Tradeoffs When Using SMT, COB, And/Or Tab Packaging Technologies", Proceedings of The I.E.E.E., pp. 343-347, Sep. 28, 1992.

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