Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Reexamination Certificate
2006-05-18
2011-11-22
Pyon, Harold (Department: 1761)
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
C438S692000, C134S002000, C134S003000
Reexamination Certificate
active
08063006
ABSTRACT:
The invention relates to an aqueous cleaning composition for wafers with copper wires that have been treated by chemical mechanical planarization in an integrated circuit processing, comprising 0.1 to 15 wt % of a nitrogen-containing heterocyclic organic base, 0.1 to 35 wt % of an alcohol amine and water. Upon contact with copper-containing semiconductor wafers that have been treated by chemical mechanical planarization for an effective period of time, the aqueous cleaning composition can effectively remove residual contaminants from the surfaces of the wafers, and simultaneously provide the copper-containing semiconductor wafers with a better surface roughness.
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Chen Chien Ching
Huo Teng Yan
Liu Wen Cheng
Shiue Jing-Chiuan
Chiang Timothy
Epoch Material Co., Ltd.
Omholt Thomas E.
Pyon Harold
Weseman Steven D.
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