Stacked wiring board and method of manufacturing stacked...

Details Stacked wiring board and method of manufacturing stacked... Stacked wiring board and method of manufacturing stacked...

2008-06-25

2011-10-18

Nguyen, Hoa C (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S809000, C361S790000, C361S729000, C361S735000, C361S736000, C174S261000

Reexamination Certificate

active

08040685

ABSTRACT:
A wiring board and method of forming the wiring board. The wiring board includes a first substrate, and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate, and at least one via formed in at least one of the first substrate or the second substrate. A thickness of a portion of the base substrate that is sandwiched between the first substrate and the second substrate is greater than a thickness of a portion of the base substrate that is not sandwiched between the first substrate and the second substrate.

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