Resin composition and multilayer structure using the same

Details Resin composition and multilayer structure using the same Resin composition and multilayer structure using the same

2009-01-07

2011-10-18

Cheung, William (Department: 1762)

Stock material or miscellaneous articles

Composite

Of polyamide

C524S417000

Reexamination Certificate

active

08039114

ABSTRACT:
It is disclosed that a resin composition comprising EVOH resin (A), polyamide resin (B) and inorganic salt (C) capable of forming a hydrate wherein the content amount of the inorganic salt (C) is in the range of 2 to 50 parts by mass based on 100 parts by mass of the EVOH resin (A), and the mass ratio ((B)/(C)) of the polyamide resin (B) to the inorganic salt (C) is in the range of 95/5 to 5/95. The resin composition exhibits excellent gas barrier property and less elution of EVOH resin even after hot water treatment, and excellent long-run processability.

REFERENCES:
patent: 4792484 (1988-12-01), Moritani
patent: 2007/0275197 (2007-11-01), Chow et al.
patent: 2008/0070052 (2008-03-01), Chow et al.
patent: 0 249 051 (1987-05-01), None
patent: 2000-136281 (2000-05-01), None
patent: 2001-151972 (2001-06-01), None
English Language Abstract JP 2001-151972, Jun. 2001.
English Language Abstract JP 2000-136281, May 2000.

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