Semiconductor apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

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Details

C257S678000, C257S685000, C257S690000, C257S698000, C257S723000

Reexamination Certificate

active

07829993

ABSTRACT:
A semiconductor apparatus comprising a silicon substrate; an device housing space including a concave portion formed in the silicon substrate and a hole perforating through the bottom surface of the concave portion; a plurality of laminated semiconductor devices provided in the device housing space; a first lid which lids the concave portion and a second lid which lids the hole, for sealing the semiconductor devices; and via plugs which are connected to the semiconductor devices, penetrating the bottom surface of the concave portion.

REFERENCES:
patent: 6495895 (2002-12-01), Peterson et al.
patent: 6617677 (2003-09-01), Steffens
patent: 6674159 (2004-01-01), Peterson et al.
patent: 7423336 (2008-09-01), Corisis et al.
patent: 2004/0173913 (2004-09-01), Ohta
patent: 2006/0216857 (2006-09-01), Zhao
patent: 2008/0029852 (2008-02-01), Murayama et al.
patent: 2004-281530 (2004-10-01), None

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