Semiconductor wafer processing tape

Equipment for production – distribution – or transformation of ene – Distribution – modification or control – Semiconductor – transistor or integrated circuit

Design Patent

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Design Patent

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D0628170

CLAIM:
The ornamental design for a “semiconductor wafer processing tape,” as shown and described.

REFERENCES:
patent: 6864295 (2005-03-01), Mitarai
patent: D589473 (2009-03-01), Takamoto et al.
patent: D598380 (2009-08-01), Kuriki
patent: 2007/0241436 (2007-10-01), Ookubo et al.
patent: 2010/0080989 (2010-04-01), Asai et al.
patent: D1267623 (2006-04-01), None
patent: 2007-2173 (2007-01-01), None
patent: D1315406 (2007-11-01), None
patent: D1315621 (2007-11-01), None

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