Heat sink assembly having a clip

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S709000, C361S710000, C257S718000, C257S719000, C165S080300, C165S185000, C024S458000, C024S459000, C024S520000, C248S510000

Reexamination Certificate

active

07746651

ABSTRACT:
A heat sink assembly includes a heat sink and a clip for mounting the heat sink to an electronic component of a printed circuit board. The heat sink includes a base and a plurality of fins extending from the base. The clip includes a pressing member and a pair of elongated arms formed on opposite ends of the pressing member. The pressing member has a lower portion protruding toward the base of the heat sink. A middle one of the fins extends upwardly through the pressing member in a manner such that the lower portion of the pressing member resiliently abuts against the heat sink. The two arms are located on opposite lateral sides of the heat sink and bent downwardly to engage with the printed circuit board so that the pressing member exerts a force on the heat sink toward the electronic component.

REFERENCES:
patent: 5818695 (1998-10-01), Olson
patent: 5973921 (1999-10-01), Lin
patent: 7055589 (2006-06-01), Lee et al.
patent: 7203066 (2007-04-01), Lee et al.
patent: 2003/0106670 (2003-06-01), Lee et al.
patent: 2003/0192672 (2003-10-01), Lee et al.
patent: 2004/0228095 (2004-11-01), Lee et al.

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