Semiconductor device, circuit substrate, electro-optic...

Details Semiconductor device, circuit substrate, electro-optic... Semiconductor device, circuit substrate, electro-optic...

2007-09-14

2010-06-22

Pham, Thanh V (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S688000, C257SE23021

Reexamination Certificate

active

07741712

ABSTRACT:
A semiconductor device in the first embodiment includes: an electrode pad and a resin projection, formed on an active surface; a conductive film deposited from a surface of the electrode pad to a surface of the resin projection; a resin bump formed with the resin projection and with the conductive film. The semiconductor device is conductively connected to the opposing substrate through the resin bump electrode. The testing electrode is formed with the conductive film that is extended and applied to the opposite side of the electrode pad across the resin projection.

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Translation of JP 11067776 A.

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