Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-06-29
2010-10-05
Gandhi, Jayprakash N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S713000, C361S704000, C361S719000, C165S080200, C257S675000, C257S713000
Reexamination Certificate
active
07808788
ABSTRACT:
A thermal conduction structure is integrated into a multi-layer circuit board to thermally couple a power electronic device to a heatsink while electrically isolating the power electronic device from the heatsink. The thermal conduction structure includes a stack of alternatingly insulative and conductive layers, a first set of vertical vias that thermally and electrically join the power electronic device to a first set of conductive layers, and a second set of vertical vias that thermally and electrically join the heatsink to a second set of conductive layers that are interleaved with the first set of conductive layers.
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International Search Report dated Oct. 2, 2008.
Gertiser Kevin M.
Lowry Michael J.
Ripple Richard A.
Schten Karl A.
Shearer Ronald M.
Delphi Technologies Inc.
Funke Jimmy L.
Gandhi Jayprakash N
Thomas Bradley H
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