Sensing arrangement

Details Sensing arrangement Sensing arrangement

2004-01-22

2010-10-12

Bella, Matthew C (Department: 2624)

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Applications

Personnel identification

C382S115000, C361S760000, C324S661000

Reexamination Certificate

active

07813534

ABSTRACT:
The invention relates to an arrangement for sensing ambient conditions in electric equipment. These conditions may include verification of the user, the location of the equipment and various properties of the environment. The invention is preferably applied in mobile terminals. One idea of the invention is to provide a sensor arrangement with a substrate (663) that forms at least part of a sensor, and also serves as a substrate for other sensors (695-698). The substrate is preferably flexible so that it can be formed in a shape which is follows the shape of the device cover. The invention also describes a way to create two- or three-dimensional electrode structures that can be used to optimize the performance of the sensor. When the surface structure is designed to follow the shape of a finger, a very small pressure is required when sliding the finger along the sensor surface. This way the use of the sensor is ergonomic and the measurement is made very reliable.

REFERENCES:
patent: 5862248 (1999-01-01), Salatino et al.
patent: 5887343 (1999-03-01), Salatino et al.
patent: 5956415 (1999-09-01), McCalley et al.
patent: 5959457 (1999-09-01), Berberich
patent: 6067368 (2000-05-01), Setlak et al.
patent: 6073343 (2000-06-01), Petrick et al.
patent: 6088585 (2000-07-01), Schmitt et al.
patent: 6175232 (2001-01-01), De Coulon et al.
patent: 6181958 (2001-01-01), Steuer et al.
patent: 6289114 (2001-09-01), Mainguet
patent: 6327376 (2001-12-01), Harkin
patent: 6347040 (2002-02-01), Fries et al.
patent: 6643389 (2003-11-01), Raynal et al.
patent: 6714666 (2004-03-01), Morimura et al.
patent: 6829950 (2004-12-01), Ganapathi et al.
patent: 7099496 (2006-08-01), Benkley, III
patent: 7251351 (2007-07-01), Mathiassen et al.
patent: 2003/0210809 (2003-11-01), Kim
patent: 0789334 (1997-08-01), None
patent: 0791899 (1997-08-01), None
patent: 06104641 (1994-04-01), None
patent: 8-305815 (1996-11-01), None
patent: 09-231346 (1997-09-01), None
patent: 09-289268 (1997-11-01), None
patent: 2000-262494 (2000-09-01), None
patent: 2001-510579 (2001-08-01), None
patent: 2001-324303 (2001-11-01), None
patent: 2002-501803 (2002-01-01), None
patent: 2002-245443 (2002-08-01), None
patent: 2002-298130 (2002-10-01), None
patent: WO 99/39631 (1999-08-01), None
patent: 0199035 (2001-12-01), None
patent: WO 02/47018 (2002-06-01), None
patent: 03075210 (2003-09-01), None
Patent Abstracts of Japan, Publication No. 2001-324303, Date of Publication: Nov. 22, 2001, 1 page.
Patent Abstracts of Japan, Publication No. 2002-298130, Date of Publication: Oct. 11, 2002, 1 page.
Patent Abstracts of Japan, Publication No. 2000-262494, Date of Publication: Sep. 26, 2000, 1 page.
Patent Abstracts of Japan, Publication No. 2002-245443, Date of Publication: Aug. 30, 2002, 1 page.
Japanese Patent Office; Takayuki Hayakawa; “Notice of Reasons for Rejection”; whole document (3 pages); May 25, 2010; with English translation (5 pages).

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