Heterojunction bipolar transistor and manufacturing method...

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Bipolar transistor

Reexamination Certificate

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C257S198000, C257SE29188

Reexamination Certificate

active

07728357

ABSTRACT:
The object of the present invention is to provide a heterojunction bipolar transistor with high breakdown tolerance which can be manufactured at a high reproducibility and a high yield, the heterojunction bipolar transistor includes: a sub-collector layer; a collector layer formed on the sub-collector layer; a base layer formed on the collector layer; and an emitter layer, which is formed on the base layer and is made of a semiconductor that has a larger bandgap than a semiconductor of the base layer, in which the collector layer includes: a first collector layer formed on the sub-collector layer; a second collector layer formed on the first collector layer; and a third collector layer formed between the second collector layer and the base layer, a semiconductor of the first collector layer differs from semiconductors of the third collector layer and the second collector layer, and an impurity concentration of the second collector layer is lower than an impurity concentration of the sub-collector layer and higher than an impurity concentration of the third collector layer.

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Sze, S. M. “Physics of Semiconductor Devices”, John Wiley & Sons, New York, London, Sidney, Toronto, 1969, pp. 282-289; Applicant's note that this document corresponds to Sze, A. “2ndEdition of Semiconductor Devices”, pp. 147 ff., which is cited and discussed, beginning at p. 4, line 3 in the specification.
English language Abstract of JP 2000-260783.
U.S. Appl. No. 11/554,221, filed Oct. 30, 2006, and entitled “Hetero-Junction Bipolar Transistor”.
Chinese Office Action dated Nov. 27, 2009 that issued with respect to patent family member Chinese Patent Application No. 2006-10169050.8.

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