Semiconductor unit, and power conversion system and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

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Details

C257S691000, C257SE23080

Reexamination Certificate

active

07816786

ABSTRACT:
A semiconductor device includes a semiconductor chip and leads electrically connected to the electrodes of the semiconductor chip. A hollow radiator base houses the semiconductor device which is molded with high-thermal-conductivity resin having an electrical insulating property. The radiator base has a cooling-medium channel therein or radiating fins on the outside. Alternatively, the radiator base is housed in a second radiator base.

REFERENCES:
patent: 5719444 (1998-02-01), Tilton et al.
patent: 5804873 (1998-09-01), Pely
patent: 6697257 (2004-02-01), Wolf et al.
patent: 7009842 (2006-03-01), Tilton et al.
patent: A 2000-091485 (2000-03-01), None
patent: A 2001-320005 (2001-11-01), None
patent: A 2001-352023 (2001-12-01), None
patent: A 2002-026215 (2002-01-01), None
patent: A 2003-511864 (2003-03-01), None
patent: A 2003-338592 (2003-11-01), None
patent: A 2004-119667 (2004-04-01), None
patent: A 2004-241477 (2004-08-01), None
patent: A 2004-296663 (2004-10-01), None
patent: 2004-342799 (2004-12-01), None
patent: 2005-026627 (2005-01-01), None
patent: WO 01/27997 (2001-04-01), None
Japanese Office Action dated Mar. 30, 2010 (3 pages).

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