Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2009-02-20
2010-10-19
Potter, Roy K (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S691000, C257SE23080
Reexamination Certificate
active
07816786
ABSTRACT:
A semiconductor device includes a semiconductor chip and leads electrically connected to the electrodes of the semiconductor chip. A hollow radiator base houses the semiconductor device which is molded with high-thermal-conductivity resin having an electrical insulating property. The radiator base has a cooling-medium channel therein or radiating fins on the outside. Alternatively, the radiator base is housed in a second radiator base.
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Japanese Office Action dated Mar. 30, 2010 (3 pages).
Hozoji Hiroshi
Ishii Toshiaki
Miyazaki Hideki
Nakatsu Kinya
Takezawa Yoshitaka
Crowell & Moring LLP
Hitachi , Ltd.
Potter Roy K
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