Socket and electronic appliances using socket

Details Socket and electronic appliances using socket Socket and electronic appliances using socket

2005-09-29

2010-10-19

Nguyen, Ha Tran T (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S760020

Reexamination Certificate

active

07816929

ABSTRACT:
The present invention is made with the aim of suppressing heat generation and thus reducing voltage drop, regarding a socket comprising probes to be connected to an electronic device such as an IC package. This is achieved by the socket6comprising heatsink components (heatsink plates74, 76, 201, and202) disposed adjacent to probes32, 34, 36so that the heatsink components move heat of the probes to a heatsink area84. The socket6includes an air layer AL encompassing at least heat-generating portions104and106in the probes. The heat-generating portions are extended to the side of the socket6and heatsink fins (heatsink slit86) are formed at its end portion. The socket6comprises a first probe32to be connected with pressure between an electrode (electrode pad26) of signal system in the electronic device (IC package4) and an electrode (electrode pad44) of a signal extraction board38corresponding to the signal system; and second probes34and36to be connected with pressure between electrodes (electrode pads28and30) of power system in the electronic device and an electric conductor (conductive plates40and42) corresponding to the power system.

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Japanese Office Action dated Mar. 9, 2010, 4 pages.

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