Die package and probe card structures and fabrication methods

Details Die package and probe card structures and fabrication methods Die package and probe card structures and fabrication methods

2006-06-21

2010-06-29

Nguyen, Thinh T (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257S780000, C257S734000, C438S617000

Reexamination Certificate

active

07745942

ABSTRACT:
A semiconductor die has conductors encapsulated in a dielectric material disposed on the active surface extending across the active surface from bond pads to one or more peripheral edges where the conductor ends are disposed at a side surface of the dielectric material. Stacks of such semiconductor dice, wherein one of the dice is configured with discrete conductive elements projecting from the active surface, and the exposed ends of the dice in the stack are connected with vertical interconnects. A probe card is disclosed having bond wires extending from one or more central contacts between one or more peripheral contacts to the edge of the probe card. A probe card having an upper layer bearing contacts and at least one window therethrough, a lower layer bearing conductive traces with ends exposed through the at least one window, and conductors extending from at least some of the contacts to conductive trace ends is also provided. Methods of making the foregoing structures are disclosed.

REFERENCES:
patent: 6208546 (2001-03-01), Ikeda
patent: 6372552 (2002-04-01), Kinsman et al.
Bober, Barbara, et al., Current Trends in Flip-Chip Bonding Technique for Multichip Modules-Especially Micro-Jet Printing, IMAPS Poland Conference 2000, http://www.cyf-kr.edu.pl/academic/OBRMHiR/imaps/data/txt/txt04.htm, printed Jan. 10, 2005, 14 pages.

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