Wiring board, electronic circuit board, electronic apparatus...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Reexamination Certificate

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Details

C257SE23019, C257SE23025, C257SE23060, C257SE23077, C257SE21503, C257S786000, C257S668000, C257S752000

Reexamination Certificate

active

07732935

ABSTRACT:
A wiring board includes a substrate made of an insulation material and wired by a conductive material. A plurality of electrodes is formed on a surface of the substrate. A non-Au electrode not having an Au surface layer and an Au electrode having the Au surface layer are formed as the electrodes.

REFERENCES:
patent: 3394527 (1968-07-01), McLean
patent: 6146764 (2000-11-01), Suokas et al.
patent: 6515744 (2003-02-01), Wei
patent: 6678144 (2004-01-01), Higashi et al.
patent: 6698648 (2004-03-01), Wunderlich et al.
patent: 6744135 (2004-06-01), Hasebe et al.
patent: 7067918 (2006-06-01), Murata et al.
patent: 7141874 (2006-11-01), Nakatani
patent: 7425762 (2008-09-01), Hasebe et al.
patent: 7486001 (2009-02-01), Kando
patent: 2001/0026888 (2001-10-01), Yokoyama et al.
patent: 2003/0052157 (2003-03-01), Wunderlich et al.
patent: 2003/0080397 (2003-05-01), Sakuyama et al.
patent: 2004/0060169 (2004-04-01), Yokoyama et al.
patent: 2004/0106232 (2004-06-01), Sakuyama et al.
patent: 2005/0112880 (2005-05-01), Wood et al.
patent: 2007/0242440 (2007-10-01), Sugaya et al.
patent: 0654818 (1995-05-01), None
patent: 58-192351 (1983-11-01), None
patent: 2-296336 (1990-12-01), None
patent: 2001-283805 (2001-10-01), None
patent: 2001-308268 (2001-11-01), None
patent: 2002-8626 (2002-01-01), None
patent: 2002-368038 (2002-12-01), None
patent: 2003-204148 (2003-07-01), None
patent: 2003-282630 (2003-10-01), None
patent: 2003-318308 (2003-11-01), None
patent: 2004-171964 (2004-06-01), None
patent: 2005-12022 (2005-01-01), None
Jun. 18, 2009 European search report in connection with a counterpart European patent application No. 05 77 0814.

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