Silicon LED package having horn and contact edge with (111)...

Details Silicon LED package having horn and contact edge with (111)... Silicon LED package having horn and contact edge with (111)...

2007-07-26

2010-12-14

Nguyen, Cuong Q (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With reflector, opaque mask, or optical element integral...

C257S099000

Reexamination Certificate

active

07851817

ABSTRACT:
A (100) silicon substrate is prepared having an insulating film formed on front and back surfaces of the silicon substrate. A resist pattern is formed on the insulating film and partially etched to form an etching mask on the front and back surfaces. The silicon substrate is subjected to anisotropical etching dependent upon an orientation to form a concave horn and a through hole, the concave horn having a bottom with a (100) plane and four inclined sidewalls with a (111) plane, and the through hole gradually narrowing from the front and back surfaces toward an inside of the silicon substrate and having a bottleneck portion with the (111) plane at an intermediate position in the silicon substrate. An LED chip is mounted on the bottom of the concave horn to form an LED package. The LED package is provided which presents high wiring reliability and simplified manufacture processes.

REFERENCES:
patent: 6583444 (2003-06-01), Fjelstad
patent: 7732233 (2010-06-01), Lin et al.
patent: 2009/0273004 (2009-11-01), Lin et al.
patent: 2009/0289272 (2009-11-01), Kim et al.
patent: 2005-277380 (2005-10-01), None

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