Die pickup apparatus for picking up semiconductor dies and...

Details Die pickup apparatus for picking up semiconductor dies and... Die pickup apparatus for picking up semiconductor dies and...

2010-03-01

2010-10-26

Osele, Mark A (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

C156S583200, C438S464000, C438S976000

Reexamination Certificate

active

07820006

ABSTRACT:
A die pickup apparatus facilitates picking up a semiconductor die in a manner such that, in a state in which a semiconductor die to be picked up is suctioned by a collet, a frontal end of a cover plate is caused to extend from a contact surface, and the cover plate is caused to slide while pushing up a dicing sheet and the semiconductor die, and subsequently a rear end of the cover plate is caused to extend from the contact surface such that an upper surface of the cover plate is substantially in parallel with the contact surface, the cover plate is caused to slide while pushing the dicing sheet and the semiconductor die with the upper surface of the cover plate such that the suction opening is opened, and the dicing sheet is suctioned into the opened suction opening, thereby separating the dicing sheet.

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International Search Report dated Oct. 13, 2009, from the corresponding International Application.

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