Preventing substrate deformation

Details Preventing substrate deformation Preventing substrate deformation

2005-11-14

2010-10-19

Trinh, Michael (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Organic semiconductor material

C257S397000, C257S059000, C257S072000, C313S504000, C313S506000

Reexamination Certificate

active

07816666

ABSTRACT:
A substrate prevented from being deformed due to thermal stress or deposition stress includes a deformation preventing layer arranged on one surface of the substrate. The substrate can include a thin film transistor arranged on one surface of the substrate and the deformation preventing layer, arranged on the another surface of the substrate, and including at least one layer.

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Office Actionfrom the Japanese Patent Office issued in Applicant's corresponding Japanese Patent Application No. 2005-223203 dated Jul. 29, 2008.
Office action from the Japanese Patent office issued in Applicant's corresponding Japanese Patent Application No. 2005-223203 dated Nov. 26, 2008.

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