Electronic equipment enclosure

Details Electronic equipment enclosure Electronic equipment enclosure

1974-04-08

1977-03-15

Nunberg, Casmir A.

Supports: cabinet structure

With heating, cooling or heat exchange means

312214, B21D 3900, A47B 7708

Patent

active

040120899

ABSTRACT:
A low-cost package for electronic components is achieved by utilizing an egrally molded, lightweight plastic enclosure having a laminated construction with inner and outer shells fabricated of lightweight, high-impact resistant plastic having sandwiched therebetween a suitable filler material to provide stiffening and structural damping. Self-contained heat pipes may be imbedded in the shell walls to provide the necessary cooling. The inner shell is formed with the necessary drawer or chassis supporting hardware through the use of molded-in-place inserts. The interior wall surfaces of the inner shell may be vacuum metalized to provide required radio frequency shielding.

REFERENCES:
patent: 2387809 (1945-10-01), Rose
patent: 2543196 (1951-02-01), Philipp
patent: 2576208 (1951-11-01), Benson
patent: 2622753 (1952-12-01), Philipp
patent: 2629698 (1953-02-01), Sterling
patent: 2893805 (1959-07-01), Ferguson
patent: 3291546 (1966-12-01), Traycoff
patent: 3353886 (1967-11-01), Tompkins
patent: 3407261 (1968-10-01), Donath et al.
patent: 3467461 (1969-09-01), Hauser
patent: 3688384 (1972-09-01), Mizushima et al.
patent: 3804481 (1974-04-01), Tillman

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