High density connector assembly having two-leveled contact...

Details High density connector assembly having two-leveled contact... High density connector assembly having two-leveled contact...

2008-06-06

2010-02-23

Patel, T C (Department: 2839)

Electrical connectors

Self aligning contact

Contact mounted in floating nonconductive holder

Reexamination Certificate

active

07666014

ABSTRACT:
A connector assembly (100) includes a first connector (10) and a mating second connector (30). Each connector includes a number of leadframes (21, 41) stacked one by one. Each leadframe has a first leadframe housing (211, 411) and a second leadframe housing (214, 414) attached to the first leadframe housing. Each connector includes an array of first terminals (5) and an array of second terminals (6) respectively mounted along the second and the first leadframe housings, and a pair of latching members (25, 45) mounted at opposite sides of the leadframes together with the first and second terminals to tie the plurality of stacked leadframes as a whole.

REFERENCES:
patent: 3673545 (1972-06-01), Rundle
patent: 4944568 (1990-07-01), Danbach et al.
patent: 5052936 (1991-10-01), Biechler et al.
patent: 5137462 (1992-08-01), Casey et al.
patent: 5330359 (1994-07-01), Walker
patent: 5904581 (1999-05-01), Pope et al.
patent: 5961355 (1999-10-01), Morlion et al.
patent: 6068518 (2000-05-01), McEuen
patent: 6155858 (2000-12-01), Ozawa et al.
patent: 6319075 (2001-11-01), Clark et al.
patent: 6409543 (2002-06-01), Astbury et al.
patent: 6453550 (2002-09-01), Farnworth et al.
patent: 6475019 (2002-11-01), Zielke et al.
patent: 6981883 (2006-01-01), Raistrick et al.
patent: 7104848 (2006-09-01), Chou et al.
patent: 7137832 (2006-11-01), Mongold et al.
patent: 7431616 (2008-10-01), Minich
patent: 2003/0220021 (2003-11-01), Whiteman et al.
patent: 2004/0259419 (2004-12-01), Payne et al.
patent: 2006/0063404 (2006-03-01), Minich et al.
patent: 2007/0287336 (2007-12-01), Buck et al.

Affiliated with

Also associated with

Rating

High density connector assembly having two-leveled contact... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High density connector assembly having two-leveled contact..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High density connector assembly having two-leveled contact... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4221118