Method of manufacturing flash memory device

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor

Reexamination Certificate

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Details

C438S017000, C438S257000, C438S598000, C257SE23002

Reexamination Certificate

active

07732226

ABSTRACT:
Disclosed are methods of manufacturing a flash memory device. The method can include performing a first test on memory banks of chips on a wafer to record an availability of the banks; performing an inking process on each of the chips according to a number of available banks in the chip; performing a sawing process to divide the chips mounted on the wafer; packaging the divided chips according to the number of available banks in the chip; and performing a verification test on the packaged chips.

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