Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2007-05-02
2010-06-01
Fulk, Steven J (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C438S617000, C257SE23023
Reexamination Certificate
active
07728443
ABSTRACT:
A method for fabricating a semiconductor component with a through wire interconnect includes the step of providing a substrate having a circuit side, a back side, and a through via. The method also includes the steps of: threading a wire through the via, forming a contact on the wire on the back side, forming a bonded contact on the wire on the circuit side, and then severing the wire from the bonded contact. The through wire interconnect includes the wire in the via, the contact on the back side and the bonded contact on the circuit side. The contact on the back side, and the bonded contact on the circuit side, permit multiple components to be stacked with electrical connections between adjacent components. A system for performing the method includes the substrate with the via, and a wire bonder having a bonding capillary configured to thread the wire through the via, and form the contact and the bonded contact. The semiconductor component can be used to form chip scale components, wafer scale components, stacked components, or interconnect components for electrically engaging or testing other semiconductor components.
REFERENCES:
patent: 3761782 (1973-09-01), Youmans
patent: 4348253 (1982-09-01), Subbarao et al.
patent: 4394712 (1983-07-01), Anthony
patent: 4710795 (1987-12-01), Nippert et al.
patent: 4808273 (1989-02-01), Hua et al.
patent: 4897708 (1990-01-01), Clements
patent: 5229647 (1993-07-01), Gnadinger
patent: 5432999 (1995-07-01), Capps
patent: 5483741 (1996-01-01), Akram et al.
patent: 5495667 (1996-03-01), Farnworth et al.
patent: 5496775 (1996-03-01), Brooks
patent: 5503285 (1996-04-01), Warren
patent: 5649981 (1997-07-01), Arnold et al.
patent: 5674785 (1997-10-01), Akram et al.
patent: 5686352 (1997-11-01), Higgins, III
patent: 5739585 (1998-04-01), Akram et al.
patent: 5824569 (1998-10-01), Brooks et al.
patent: 5840199 (1998-11-01), Warren
patent: 5852871 (1998-12-01), Khandros
patent: 5894983 (1999-04-01), Beck et al.
patent: 5931685 (1999-08-01), Hembree et al.
patent: 5950070 (1999-09-01), Razon et al.
patent: 5990546 (1999-11-01), Igarashi et al.
patent: 6002177 (1999-12-01), Gaynes et al.
patent: 6033614 (2000-03-01), Bolken et al.
patent: 6043564 (2000-03-01), Brooks et al.
patent: 6100175 (2000-08-01), Wood et al.
patent: 6107109 (2000-08-01), Akram et al.
patent: 6114240 (2000-09-01), Akram et al.
patent: 6184587 (2001-02-01), Khandros et al.
patent: 6235554 (2001-05-01), Akram et al.
patent: 6251703 (2001-06-01), Van Campenhout et al.
patent: 6294837 (2001-09-01), Akram et al.
patent: 6326689 (2001-12-01), Thomas
patent: 6368896 (2002-04-01), Farnworth et al.
patent: 6380555 (2002-04-01), Hembree et al.
patent: 6395581 (2002-05-01), Choi
patent: 6400172 (2002-06-01), Akram et al.
patent: 6435200 (2002-08-01), Langen
patent: 6437254 (2002-08-01), Crudo
patent: 6444576 (2002-09-01), Kong
patent: 6451624 (2002-09-01), Farnworth et al.
patent: 6465877 (2002-10-01), Farnworth et al.
patent: 6494221 (2002-12-01), Sellmer et al.
patent: 6501165 (2002-12-01), Farnworth et al.
patent: 6528984 (2003-03-01), Beaman et al.
patent: 6566747 (2003-05-01), Ohuchi et al.
patent: 6569762 (2003-05-01), Kong
patent: 6577013 (2003-06-01), Glenn et al.
patent: 6582992 (2003-06-01), Poo et al.
patent: 6600221 (2003-07-01), Kimura
patent: 6601888 (2003-08-01), McIlwraith et al.
patent: 6605551 (2003-08-01), Wermer et al.
patent: 6608371 (2003-08-01), Kurashima et al.
patent: 6611052 (2003-08-01), Poo et al.
patent: 6614104 (2003-09-01), Farnworth et al.
patent: 6620633 (2003-09-01), Hembree et al.
patent: 6620731 (2003-09-01), Farnworth et al.
patent: 6653170 (2003-11-01), Lin
patent: 6680213 (2004-01-01), Farnworth et al.
patent: 6717245 (2004-04-01), Kinsman et al.
patent: 6724074 (2004-04-01), Song et al.
patent: 6727116 (2004-04-01), Poo et al.
patent: 6731013 (2004-05-01), Juso et al.
patent: 6740582 (2004-05-01), Siniaguine
patent: 6740960 (2004-05-01), Farnworth
patent: 6803303 (2004-10-01), Hiatt et al.
patent: 6812549 (2004-11-01), Umetsu et al.
patent: 6828175 (2004-12-01), Wood et al.
patent: 6833317 (2004-12-01), Forbes et al.
patent: 6833612 (2004-12-01), Kinsman
patent: 6833613 (2004-12-01), Akram et al.
patent: 6841883 (2005-01-01), Farnworth et al.
patent: 6846725 (2005-01-01), Nagarajan et al.
patent: 6848177 (2005-02-01), Swan et al.
patent: 6858092 (2005-02-01), Langen
patent: 6881648 (2005-04-01), Chen et al.
patent: 6882057 (2005-04-01), Hsu
patent: 6896170 (2005-05-01), Lyn et al.
patent: 6903443 (2005-06-01), Farnworth et al.
patent: 6906418 (2005-06-01), Hiatt et al.
patent: 6908784 (2005-06-01), Farnworth et al.
patent: 6933524 (2005-08-01), Hembree et al.
patent: 6936913 (2005-08-01), Akerling et al.
patent: 6952054 (2005-10-01), Akram et al.
patent: 6954000 (2005-10-01), Hembree et al.
patent: 6964915 (2005-11-01), Farnworth et al.
patent: 6998344 (2006-02-01), Akram et al.
patent: 6998717 (2006-02-01), Farnworth et al.
patent: 7029949 (2006-04-01), Farnworth et al.
patent: 7060526 (2006-06-01), Farnworth et al.
patent: 7078266 (2006-07-01), Wood et al.
patent: 7078922 (2006-07-01), Kirby
patent: 7108546 (2006-09-01), Miller et al.
patent: 7112469 (2006-09-01), Mihara
patent: 7119001 (2006-10-01), Kang
patent: 7132731 (2006-11-01), Wood et al.
patent: 7132741 (2006-11-01), Lin et al.
patent: 7180149 (2007-02-01), Yamamoto et al.
patent: 7307348 (2007-12-01), Wood et al.
patent: 7371676 (2008-05-01), Hembree
patent: 7393770 (2008-07-01), Wood et al.
patent: 7579267 (2009-08-01), Wood et al.
patent: 2002/0017710 (2002-02-01), Kurashima et al.
patent: 2002/0117330 (2002-08-01), Eldridge et al.
patent: 2003/0230805 (2003-12-01), Noma et al.
patent: 2003/0232460 (2003-12-01), Poo et al.
patent: 2004/0235270 (2004-11-01), Noma et al.
patent: 2004/0256734 (2004-12-01), Farnworth et al.
patent: 2005/0029650 (2005-02-01), Wood et al.
patent: 2005/0082654 (2005-04-01), Humpston et al.
patent: 2005/0205951 (2005-09-01), Eskridge
patent: 2006/0017177 (2006-01-01), Seng
patent: 2006/0163679 (2006-07-01), LaFond et al.
patent: 2006/0228825 (2006-10-01), Hembree
patent: 2007/0126091 (2007-06-01), Wood et al.
patent: 2007/0138498 (2007-06-01), Zilber et al.
patent: 2007/0167000 (2007-07-01), Wood et al.
patent: 2007/0200255 (2007-08-01), Hembree
patent: 2007/0202617 (2007-08-01), Hembree
patent: 2007/0246819 (2007-10-01), Hembree
patent: 2008/0038868 (2008-02-01), Leib
patent: 2008/0042247 (2008-02-01), Wood et al.
patent: 2008/0203539 (2008-08-01), Wood et al.
patent: 2008/0206990 (2008-08-01), Wood et al.
patent: 2008/0229573 (2008-09-01), Wood et al.
patent: 516194 (2003-01-01), None
patent: 571420 (2004-01-01), None
Leon Oboler, “Still at the Head of the Class”, Chip Scale Review, Internet article, Jul./Aug. 1999, pp. 1-7.
IBM and SUSS announce semiconductor technology agreement, Sep. 13, 2004, pp. 1-2.
IBM Research & IBM Systems and Technology Group, C4NP Technology for lead-free wafer bumping, internet article, Sep. 2004, pp. 1-13.
Office Action dated Oct. 17, 2007 from U.S. Appl. No. 11/102,408 (US Patent No. 7,371,676).
Office Action dated Jul. 11, 2007 from U.S. Appl. No. 11/102,408 (US Patent No. 7,371,676).
Notice of Allowance dated Jan. 7, 2008 from U.S. Appl. No. 11/102,408 (US Patent No. 7,371,676).
Office Action dated Jun. 4, 2007 from U.S. Appl. No. 11/296,057 (US Patent No. 7,307,348.
Notice of Allowance dated Mar. 8, 2007 from U.S. Appl. No. 11/296,057 (US Patent No. 7,307,348).
Office Action dated Nov. 14, 2008 from U.S. Appl. No. 11/712,815.
Office Action dated Oct. 31, 2007 from U.S. Appl. No. 11/133,085 (US Patent No. 7,393,770).
Office Action dated Feb. 11, 2008 from U.S. Appl. No. 11/133,085 (US Patent No. 7,393,770).
Notice of Allowance dated Mar. 5, 2008 from U.S. Appl. No. 11/133,085 (US Patent No. 7,393,770).
Office Action dated Mar. 12, 2009 from U.S. Appl. No. 11/409,638.
PCT Search Report from International Application No. PCT/US2006/010044 dated Nov. 7, 2007.
PCT Search Report from International Application No. PCT/US2007/002336 dated Feb. 13, 2008.
PCT Search Report from International Application No. PCT/US200
Fulk Steven J
Gratton Stephen A.
Micro)n Technology, Inc.
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