Thermoplastic material

Details Thermoplastic material Thermoplastic material

2004-08-18

2010-06-15

Huson, Monica A (Department: 1791)

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

Shaping against forming surface

C264S328180

Reexamination Certificate

active

07736573

ABSTRACT:
A circuit package for housing semiconductor or other integrated circuit devices (“die”) includes a high-copper flange, one or more high-copper leads and a liquid crystal polymer frame molded to the flange and the leads. The flange includes a dovetail-shaped groove or other frame retention feature that mechanically interlocks with the molded frame. During molding, a portion of the frame forms a key that freezes in or around the frame retention feature. The leads include one or more lead retention features to mechanically interlock with the frame. During molding, a portion of the frame freezes in or adjacent these lead retention features. The frame includes compounds to prevent moisture infiltration and match its coefficient of thermal expansion (CTE) to the CTE of the leads and flange. The is frame is formulated to withstand die-attach temperatures. A lid is ultrasonically welded to the frame after a die is attached to the flange.

REFERENCES:
patent: 4288081 (1981-09-01), Sado
patent: 4343376 (1982-08-01), Tsukagoshi et al.
patent: 4880591 (1989-11-01), Baba
patent: 5151149 (1992-09-01), Swartz
patent: 5586214 (1996-12-01), Eckman
patent: 5691689 (1997-11-01), Smith et al.
patent: 5700724 (1997-12-01), Shipe
patent: 5731542 (1998-03-01), Limper-Brenner et al.
patent: 5792984 (1998-08-01), Bloom
patent: 6204448 (2001-03-01), Garland et al.
patent: 6211463 (2001-04-01), Fabis
patent: 6214152 (2001-04-01), Ross et al.
patent: 6242694 (2001-06-01), Muraki
patent: 6379795 (2002-04-01), Bisaria et al.
patent: 6462413 (2002-10-01), Polese et al.
patent: 6489677 (2002-12-01), Okada et al.
patent: 6511866 (2003-01-01), Bregante et al.
patent: 6521989 (2003-02-01), Zhou
patent: 7429791 (2008-09-01), Kurihara et al.
patent: 9/22969 (1997-01-01), None
patent: 2002-76158 (2002-03-01), None
patent: 2004-179584 (2004-06-01), None
Cookson Electronics, “Parylene Applications,” http://www.scscookson.com/applications, p. 1, 2003.
Cookson Electronics, “SCS Parylene's Benefits to an Electronic Component,” http://www.scscookson.com/applications, pp. 1-2, 2003.
Sud-Chemie Group, “Zeolite Powders for various applications,” http://www.sud-chemie.com/scmcms/web/content, p. 1.
Sumitomo Chemical Co., Ltd., “Products Sumika Super LCP,” http://www.sumitomo-chem.com.jp/sep/english/0221LCP/LCP—41densi.html, pp. 1-13, 2001.
Cluff et al.,10A.1 Electronic Packaging Technologies, CRC Press LLC(2001).

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