Support assembly for integrated circuits

Details Support assembly for integrated circuits Support assembly for integrated circuits

1987-01-28

1989-01-24

Sikes, William L.

357 69, 357 72, H01L 2348, H01L 2328

Patent

active

048004197

ABSTRACT:
A composite support assembly for an integrated circuit chip includes a rigid lead frame that is attached to a relatively thin flexible tape-like structure. The tape-like structure is etched with inner lead fingers and outer lead fingers to allow a short pitch, high density arrangement of the lead fingers, thereby enabling bond wires that connect an IC chip to the support assembly to be shortened. As a result, a significant increase in the number of leads is realized, using a standard size IC package.

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patent: 4538210 (1985-08-01), Schaller
patent: 4661837 (1987-04-01), Sono

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