Cooling manifold assembly

Details Cooling manifold assembly Cooling manifold assembly

2009-01-13

2010-12-21

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080400, C165S104330, C361S700000, C361S719000

Reexamination Certificate

active

07855888

ABSTRACT:
A cooling apparatus comprising a cooling manifold assembly is disclosed. The cooling manifold assembly comprises a manifold inlet end cap, a manifold outlet end cap and at least one cooling manifold. Cooling fluid flows into the manifold inlet end cap, through the cooling manifold, and the exits from the manifold outlet end cap. The cooling manifold is configured to rotate from a closed position into an open position without breaking a fluid seal between the manifold inlet end cap, the cooling manifold, and the manifold outlet end cap.

REFERENCES:
patent: 5161089 (1992-11-01), Chu et al.
patent: 6349035 (2002-02-01), Koenen
patent: 7372702 (2008-05-01), Gauche et al.
patent: 7450385 (2008-11-01), Campbell et al.
patent: 7558662 (2009-07-01), Yamaguchi et al.
patent: 7646603 (2010-01-01), Bard et al.
patent: 2005/0243517 (2005-11-01), Malone et al.
patent: 2006/0232945 (2006-10-01), Chu et al.
patent: 2008/0018212 (2008-01-01), Spearing et al.
patent: 2008/0259567 (2008-10-01), Campbell et al.
patent: 2008/0264613 (2008-10-01), Chu
patent: 2009/0294106 (2009-12-01), Flotta et al.
patent: 2010/0085712 (2010-04-01), Hrehor et al.

Affiliated with

Also associated with

Rating

Cooling manifold assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cooling manifold assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling manifold assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4217404