Metal working – Means to assemble or disassemble – Means to assemble electrical device
Reexamination Certificate
2007-12-27
2010-11-30
Banks, Derris H (Department: 3729)
Metal working
Means to assemble or disassemble
Means to assemble electrical device
C029S842000, C029S846000
Reexamination Certificate
active
07841074
ABSTRACT:
A method of fabricating a paste bump for a printed circuit board, provides preparing a base plate; printing a conductive paste on the base plate and drying the conductive paste on the base plate, thus forming a first paste bump; flattening an upper surface of the first paste bump through coining; and printing a conductive paste on the first paste bump and drying the conductive paste on the first bump, thus forming a second paste bump, wherein the printing a conductive paste on the base plate and drying the conductive paste on the base plate includes placing a first mask having a hole having a first size on the base plate; applying a conductive paste on the first mask, and pressing the conductive paste using a squeegee; filling the hole having a first size in the first mask with the conductive paste, and sticking a bottom of the conductive paste to the base plate; and removing the first mask and drying the conductive paste, thus forming the first paste bump.
REFERENCES:
patent: 6709966 (2004-03-01), Hisatsune et al.
patent: 6889433 (2005-05-01), Enomoto et al.
patent: 7422973 (2008-09-01), Shiu et al.
patent: 2001-230537 (2001-08-01), None
patent: 2001230537 (2001-08-01), None
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patent: 657406 (2006-12-01), None
Korean Patent Office Action, mailed May 26, 2008 and issued in corresponding Korean Patent Application No. 10-2007-0057370.
Kim Ki Hwan
Kim Sung Yong
Mok Jee Soo
Park Jun Heyoung
Park Sang Hyun
Banks Derris H
Parvez Azm
Samsung Electro-Mechanics Co. Ltd.
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