Method for dicing wafer and process for manufacturing...

Details Method for dicing wafer and process for manufacturing... Method for dicing wafer and process for manufacturing...

2009-05-20

2010-11-23

Gray, Linda L (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S268000, C156S272200, C156S275100, C156S275500

Reexamination Certificate

active

07837820

ABSTRACT:
A method for dicing a wafer having a first face in which opening are arranged along dicing streets. The method includes a step of affixing a dicing tape to the first face such that the dicing tape lies over the openings and adhesive regions of the dicing tape are exposed in the openings and a step of treating the dicing tape to reduce the adhesive strength of the adhesive regions.

REFERENCES:
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patent: 6171163 (2001-01-01), Seko et al.
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patent: 6555417 (2003-04-01), Spooner et al.
patent: 6893574 (2005-05-01), Felton et al.
patent: 2003/0211707 (2003-11-01), Brouillette et al.
patent: 2005/0098877 (2005-05-01), Adachi et al.
patent: 62-079649 (1987-04-01), None

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