Phenolic OH and radically polymerizable group containing...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

Reexamination Certificate

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C525S423000

Reexamination Certificate

active

07834100

ABSTRACT:
A heat-curable resin composition, comprising(A) a polyimide silicone resin having a phenolic hydroxyl group and a radically polymerizable group bonded to a silicon atom,(B) an epoxy resin in such an amount that a molar ratio of the epoxy groups of the epoxy resin to the phenolic hydroxyl groups of the polyimide silicone resin (A) ranges from 0.2 to 10, anda catalytic amount of (C) an organic peroxide.

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patent: 2004/0265731 (2004-12-01), Okada et al.
patent: 2005/0065296 (2005-03-01), Kozakai et al.
patent: 2009/0062480 (2009-03-01), Yoneda et al.
patent: 0 328 027 (1989-08-01), None
patent: 2-036232 (1990-02-01), None
patent: 10-195278 (1998-07-01), None

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