Microfluidic device for the assembly and transport of...

Chemistry: electrical and wave energy – Processes and products – Electrophoresis or electro-osmosis processes and electrolyte...

Reexamination Certificate

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C204S632000

Reexamination Certificate

active

07744737

ABSTRACT:
A microfluidic device comprising independently addressable arrays of interdigitated electrodes can be used to assembly and transport large-scale microparticle structures. The device and method uses collective phenomena in a negatively polarized suspension exposed to a high-gradient strong ac electric field to assemble the particles into predetermined locations and then transport them collectively to a work area for final assembly by sequentially energizing the electrode arrays.

REFERENCES:
patent: 6596143 (2003-07-01), Wang et al.
patent: 6858439 (2005-02-01), Xu et al.
patent: WO-0105514 (2001-01-01), None
Dawn J. Bennett et al, “Combined field-induced dielectrophoresis and phase separation for manipulating particles in microfluidics”, Applied Physics Letters, vol. 83, No. 23, 2003, pp. 4866-4868.
Pei Yu Chiou et al, “Massively parallel manipulation of single cells and microparticles using optical images”, Nature Publishing Group, vol. 436, 2005, pp. 370-372.
David G. Grier, “A revolution in optical manipulation,” insight review articles, Nature Publishing Group, vol. 424, 2003, pp. 810-816.
T. P. Hunt et al, “Addressable micropost array for the dielectrophoretic manipulation of particles in fluid”, Applied Physics Letters, 2004, vol. 85, No. 26, pp. 6421-6423.
Anil Kumar et al, “Conveyor-belt method for assembling microparticles into large-scale structures using electric fields”, Applied Physics Letters, vol. 90, 2007, pp. 154104-1 through 154104-3.
S. Tsukahara et al, “Dielectrophoresis of microbioparticles in water with planar and capillary quadrupole electrodes”, IEE Pro.-Nanobiotechnol, vol. 150, No. 2 2003, pp. 59-65.
J.J. Sniegowski et al, “IC-Compatible Polysilicon Surface Micromachining”, Annu. Rev. Mater. Sci., 2000, vol. 30 pp. 299-333.

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