Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2009-12-19
2010-10-12
Garber, Charles D (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S003000, C438S005000, C438S108000, C257S723000, C257S724000, C257S777000, C257S778000, C257SE23010, C257SE23041, C340S653000, C714S100000, C439S055000, C439S057000, C439S068000
Reexamination Certificate
active
07811854
ABSTRACT:
A system is described that can assemble substrates over one another to form a stacked substrate. The various layers of the stacked substrate can be separated from each other by using Coulomb forces. In addition, a beam substrate can be used to increase the separation. In addition, a first substrate can be flipped around and connected to the edge of a second substrate. The instructions for assembly and a FSM (Finite State Machine) can be included in the stacked substrate to pave the way for a self-constructing3-D automaton. The beam substrate can be used to carry heat, fluids, electrical power or signals between the various layers of the stacked cells besides providing a mechanical support. A stacked substrate can be assembled into 3-D structures. These structures can have applications in antennas and RF circuits, for example.
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Abdelaziez Yasser A
Gabara Thaddeus
Garber Charles D
Metamems Corp.
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