Conductive ball mounting method

Details Conductive ball mounting method Conductive ball mounting method

2008-07-15

2010-10-26

Nhu, David (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S706000, C438S745000, C257SE21229, C257SE21245, C257SE21499, C257SE21508

Reexamination Certificate

active

07820479

ABSTRACT:
There is provided a method of mounting one conductive ball on each of a plurality of connection pads on a substrate. The method includes: (a) providing a pre-alignment base including: a support layer formed to allow a flux to pass therethrough; and an alignment layer provided on the support layer and having pockets for containing the conductive ball; (b) applying a paste containing the conductive balls dispersed in the flux onto the alignment layer such that each of the pockets receives one of the conductive balls together with the flux; (c) aligning the pre-alignment base with the substrate such that each of the pockets corresponds to one of the connections pads; and (d) transferring the paste contained in each of the pockets onto the connection pads, thereby mounting the conductive balls along with the flux on the connection pads.

REFERENCES:
patent: 5284287 (1994-02-01), Wilson et al.
patent: 5431332 (1995-07-01), Kirby et al.
patent: 5655704 (1997-08-01), Sakemi et al.
patent: 5658827 (1997-08-01), Aulicino et al.
patent: 6191022 (2001-02-01), Creswick
patent: 09-107045 (1997-04-01), None
patent: 10-126046 (1998-05-01), None
patent: 2001-320160 (2001-11-01), None

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