Semiconductor device

Details Semiconductor device Semiconductor device

2008-09-25

2010-11-16

Prenty, Mark (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C257SE23015

Reexamination Certificate

active

07834418

ABSTRACT:
A semiconductor device (100) includes a semiconductor substrate (2), an inductor (4) provided on the semiconductor substrate (2), a metal ball (8) provided on the inductor (4) so as to come into contact with the inductor (4), and a bonding wire (10) electrically connected to the metal ball (8). The semiconductor device (100) exchanges signals with an external via the inductor (4) and the metal ball (8). The inductor (4) also serves as the bonding pad and therefore the inductor and the bonding pad need not to be arranged in pairs.

REFERENCES:
patent: 6878633 (2005-04-01), Raskin et al.
patent: 2009/0085208 (2009-04-01), Uchida
patent: 2006-311423 (2006-11-01), None

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