Heat sink assembly having a fin also functioning as a...

Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material

Reexamination Certificate

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Details

C257S715000, C361S700000

Reexamination Certificate

active

07661466

ABSTRACT:
A heat sink assembly (100) for cooling a heat-generating electronic component, includes a base plate (32), a plurality of fins (50) mounted on the base plate and a heat pipe (20) thermally connecting the base plate and the fins. The fins are parallel to the base plate and include a bottom fin (40) supporting the fins on the base plate. The bottom fin includes a plurality of supporting tabs (422) engaging with the base plate and separating a body (42) of the bottom fin from the base plate. The bottom fin can be used not only for dissipating heat into a surrounding environment but also for reinforcing the whole strength of the heat sink assembly.

REFERENCES:
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patent: 7215548 (2007-05-01), Wu et al.
patent: 7249626 (2007-07-01), Hao et al.
patent: 7443676 (2008-10-01), Li
patent: 7443679 (2008-10-01), Li et al.
patent: 7447035 (2008-11-01), Liu et al.
patent: 2005/0082041 (2005-04-01), Chen et al.
patent: 2006/0082972 (2006-04-01), Kim
patent: 2008/0121372 (2008-05-01), Zhou et al.
patent: 2008/0128111 (2008-06-01), Zhou et al.
patent: 2008/0128118 (2008-06-01), Chen et al.
patent: 2008/0135215 (2008-06-01), Wu
patent: 2008/0144286 (2008-06-01), Li et al.
patent: 2008/0314556 (2008-12-01), Zhou et al.

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