Polyimide oligomers and blends and method of curing

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From phenol – phenol ether – or inorganic phenolate

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528125, 528126, 528128, 528170, 528171, 528172, 528183, 528184, 528185, 528186, 528188, 528208, 528220, 528226, 528229, 528322, 528331, 528, 528352, 528353, 526259, 526261, 526262, 525425, 525436, C08G 7310, C08G 7312, C08G 802, C08G 6908

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active

051169355

ABSTRACT:
A preferred class of polyimide oligomers include (1) linear, difunctional crosslinking oligomers prepared by condensing an imidophenylamine end cap with a lower alkylene diamine or a polyaryldiamine such as 3,3'-phenoxyphenylsulfone diamine and with a dianhydride, particularly 4,4'-phenoxyphenylsulfone dianhydride; and (2) multidimensional, crosslinking, polyimide oligomers having an aromatic hub and at least two radiating arms connected to the hub, each arm including a crosslinking imidophenylamine end cap at its distal end and at least two imide linkages.
Blends, prepregs, and composites can be prepared from the oligomers.
Also described is a method for improving the thermal stability of composites prepared from linear and multidimensional polyimide oligomers and blends which includes the steps of (a) impregnating a fabric with a polyimide oligomer or blend to form a prepreg; (b) heating the prepreg at an elevated temperature and under pressure for a time sufficient to cure the prepreg and form a composite; and (c) post-curing the composite at a temperature of approximately 700.degree. F. and for a time sufficient to improve the thermal stability thereof.

REFERENCES:
patent: 3528950 (1970-09-01), Lubowitz
patent: 3565549 (1971-02-01), Lubowitz et al.
patent: 3745149 (1973-07-01), Serafini et al.
patent: 3998786 (1976-12-01), D'Alelio
patent: 4055543 (1977-10-01), D'Alelio
patent: 4075171 (1978-02-01), D'Alelio
patent: 4142870 (1979-03-01), Lovejoy
patent: 4244853 (1981-01-01), Serafini et al.
patent: 4251417 (1981-02-01), Chow et al.
patent: 4251418 (1981-02-01), Chow et al.
patent: 4251420 (1981-02-01), Antonopolos et al.
patent: 4271079 (1981-06-01), Maeda et al.
patent: 4299946 (1981-11-01), Blame et al.
patent: 4376710 (1983-03-01), Gardos et al.
patent: 4381363 (1983-04-01), Reinhart, Jr.
patent: 4389504 (1983-06-01), St. Clair et al.
patent: 4414269 (1983-11-01), Lubowitz et al.
patent: 4417039 (1983-11-01), Reinhardt et al.
patent: 4417044 (1983-11-01), Parekh
patent: 4418181 (1983-11-01), Monacelli
patent: 4438280 (1984-03-01), Monacelli
patent: 4476184 (1984-10-01), Lubowitz et al.
patent: 4579957 (1986-04-01), Kanayama et al.
patent: 4604437 (1986-08-01), Renner
patent: 4624888 (1986-11-01), St. Clair et al.
patent: 4675414 (1987-06-01), DeFusco et al.
patent: 4680377 (1987-07-01), Matsumura et al.
patent: 4684714 (1987-08-01), Lubowitz et al.
patent: 4772722 (1988-09-01), Lukacs, III
patent: 4851501 (1989-07-01), Lubowitz et al.
patent: 4868270 (1989-09-01), Lubowitz et al.
patent: 4876328 (1989-10-01), Lubowitz et al.
R. Vannucci, "PMR Polyimide Compositions for Improved Performance at 371.degree. C.", NASA N87-16071, 1987.
EPO Search Report for U.S. Ser. No. 07/046,376.
St. Clair et al., "Additives Lower Pickup of Moisture by Polyimides", NASA Tech Briefs, Apr. 1989, p. 28.

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