Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2008-01-30
2010-12-14
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S773000, C257S776000, C257S778000, C257S784000, C257SE25005, C257SE25010, C257SE25012, C257SE25016, C257SE25020, C257SE25026, C257SE23020, C257SE23021
Reexamination Certificate
active
07851907
ABSTRACT:
Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to temporarily hold the die in position with respect to the PCB until the circuit is wire bonded and an underfill material is cured between the die and the PCB to more permanently connect them together. The underfill material is selected to have a coefficient of thermal expansion (CTE) that is substantially equal to the CTE of the solder balls to prevent thermal mismatch problems. An overmolding compound is disposed about the die and the underfill material and about the wire bonds to complete the package. Various arrangements of the solder ball pads on the die include columnar and row, corner, diagonal, cross, and periphery arrangements.
REFERENCES:
patent: 5311059 (1994-05-01), Banerji et al.
patent: 5400950 (1995-03-01), Myers et al.
patent: 5410181 (1995-04-01), Zollo et al.
patent: 5748450 (1998-05-01), Kim et al.
patent: 5811317 (1998-09-01), Maheshwari et al.
patent: 5898224 (1999-04-01), Akram
patent: RE36325 (1999-10-01), Corbett et al.
patent: 5994166 (1999-11-01), Akram et al.
patent: 6008071 (1999-12-01), Karasawa et al.
patent: 6048755 (2000-04-01), Jiang et al.
patent: 6051878 (2000-04-01), Akram et al.
patent: 6084297 (2000-07-01), Brooks et al.
patent: 6121576 (2000-09-01), Hembree
patent: 6127724 (2000-10-01), DiStefano
patent: 6150724 (2000-11-01), Wenzel et al.
patent: 6160715 (2000-12-01), Degani et al.
patent: 6175157 (2001-01-01), Morifuji
patent: 6198162 (2001-03-01), Corisis
patent: 6208156 (2001-03-01), Hembree
patent: 6214716 (2001-04-01), Akram
patent: 6222265 (2001-04-01), Akram et al.
patent: 6225702 (2001-05-01), Nakamura
patent: 6232666 (2001-05-01), Corisis et al.
patent: 6258626 (2001-07-01), Wang et al.
patent: 6326244 (2001-12-01), Brooks et al.
patent: 6329222 (2001-12-01), Corisis et al.
patent: 6329637 (2001-12-01), Hembree et al.
patent: 6391762 (2002-05-01), Gamota et al.
patent: 6400574 (2002-06-01), Stephenson et al.
patent: 6462420 (2002-10-01), Hikita et al.
patent: 6500764 (2002-12-01), Pritchett
patent: 6503781 (2003-01-01), Stephenson et al.
patent: 6504389 (2003-01-01), Hembree et al.
patent: 6507114 (2003-01-01), Hui et al.
patent: 6522018 (2003-02-01), Tay et al.
patent: 6533159 (2003-03-01), Cobbley et al.
patent: 6559537 (2003-05-01), Bolken et al.
patent: 6576495 (2003-06-01), Jiang et al.
patent: 6576496 (2003-06-01), Bolken et al.
patent: 6577004 (2003-06-01), Rumsey et al.
patent: 6583502 (2003-06-01), Lee et al.
patent: 6595408 (2003-07-01), Cobbley et al.
patent: 6599822 (2003-07-01), Akram
patent: 6600335 (2003-07-01), Tay et al.
patent: 6602733 (2003-08-01), Iwahashi et al.
patent: 6603071 (2003-08-01), Takao
patent: 6638792 (2003-10-01), Hui et al.
patent: 6646286 (2003-11-01), Akram
patent: 6660558 (2003-12-01), Boken et al.
patent: 6661103 (2003-12-01), Akram
patent: 6661104 (2003-12-01), Jiang et al.
patent: 6680213 (2004-01-01), Farnworth et al.
patent: 6687989 (2004-02-01), Farnworth et al.
patent: 6700183 (2004-03-01), Jiang
patent: 6724084 (2004-04-01), Hitika et al.
patent: 6736306 (2004-05-01), Byun et al.
patent: 6750552 (2004-06-01), Narayanan
patent: 6762495 (2004-07-01), Reyes et al.
patent: 6778404 (2004-08-01), Bolken et al.
patent: 6781245 (2004-08-01), Huang
patent: 6825569 (2004-11-01), Jiang et al.
patent: 6889430 (2005-05-01), Jiang et al.
patent: 7268067 (2007-09-01), Hall et al.
patent: 7276802 (2007-10-01), Hall et al.
patent: 7342319 (2008-03-01), Hall et al.
patent: 7468559 (2008-12-01), Hall et al.
patent: 2002/0096784 (2002-07-01), Kamikuri et al.
patent: 2002/0100976 (2002-08-01), Hui et al.
patent: 2002/0114135 (2002-08-01), Akram et al.
patent: 2002/0149298 (2002-10-01), Furukawa et al.
patent: 2002/0167077 (2002-11-01), Vincent
patent: 2002/0187590 (2002-12-01), Bolken et al.
patent: 2002/0195718 (2002-12-01), Imasu et al.
patent: 2003/0027377 (2003-02-01), Owens
patent: 2003/0116866 (2003-06-01), Cher'Khng et al.
patent: 2003/0193088 (2003-10-01), Hall et al.
patent: 2004/0004292 (2004-01-01), Hsieh et al.
patent: 2004/0084771 (2004-05-01), Bolken et al.
patent: 2004/0164412 (2004-08-01), Bolken et al.
patent: 2004/0200885 (2004-10-01), Derderian
patent: 2004/0212067 (2004-10-01), Wang
patent: 2005/0019983 (2005-01-01), Bolken et al.
patent: 2005/0026327 (2005-02-01), Hall et al.
patent: 2345191 (2000-06-01), None
patent: 09-232375 (1997-09-01), None
patent: 2003-234435 (2003-08-01), None
patent: 2001027290 (2001-04-01), None
Fan, L. , et al., “Incorporation of Inorganic Filler into the No-Flow Underfill Material for Flip-Chip Application”,International Symposium on Advanced Packaging Materials,(2000),303-310.
Baerlocher Cary J.
Hall Frank L.
Clark Jasmine J
Micro)n Technology, Inc.
Schwegman Lundberg & Woessner, P.A.
LandOfFree
Semiconductor integrated circuit package having electrically... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor integrated circuit package having electrically..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor integrated circuit package having electrically... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4208140