LED package structure and method of packaging the same

Details LED package structure and method of packaging the same LED package structure and method of packaging the same

2009-06-26

2010-12-28

Lindsay, Jr., Walter L (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Making emissive array

C438S035000, C257SE33057, C257S099000, C361S540000

Reexamination Certificate

active

07858416

ABSTRACT:
An LED package structure includes a first LED chip, a second LED chip arranged on the minor light-emitting surface of the first LED chip, a conductive unit connected between the electrode areas for parallel or serially connecting the two LED chips together, and two external electric conduction units for electrically connecting both the first and second electrode areas of the first LED chip with an external circuit.

REFERENCES:
patent: 2004/0129944 (2004-07-01), Chen
patent: 2005/0082974 (2005-04-01), Fukasawa et al.
patent: 2005/0211992 (2005-09-01), Nomura et al.
patent: 2005/0280352 (2005-12-01), Lai
patent: 2006/0001055 (2006-01-01), Ueno et al.
patent: 2006/0067073 (2006-03-01), Ting

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