Process for manufacturing probes intended to interact with a...

Details Process for manufacturing probes intended to interact with a... Process for manufacturing probes intended to interact with a...

2007-12-18

2010-12-14

Berman, Jack I (Department: 2881)

Scanning-probe techniques or apparatus; applications of scanning

General aspects of spm probes, their manufacture, or their...

Probe manufacture

C977S902000, C977S943000, C977S947000, C850S007000, C850S052000, C850S055000, C850S056000, C850S057000, C850S058000, C850S059000, C850S062000

Reexamination Certificate

active

07854016

ABSTRACT:
A process manufactures a probe intended to interact with a storage medium of a probe-storage system, wherein a sacrificial layer is deposited on top of a substrate; a hole is formed in the sacrificial layer; a mold layer is deposited; the mold layer is etched via the technique for forming spacers so as to form a mold region delimiting an opening having an area decreasing towards the substrate. Then a stack of conductive layers is deposited on top of the sacrificial layer, the stack is etched so as to form a suspended structure, formed by a pair of supporting arms arranged to form a V, and an interaction tip projecting monolithically from the supporting arms. Then a stiffening structure is formed, of insulating material, and the suspended structure is fixed to a supporting wafer. The substrate, the sacrificial layer, and, last, the mold region are then removed.

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patent: 2009/0003189 (2009-01-01), Binnig et al.
patent: 2010/0017922 (2010-01-01), Shin et al.

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