Circuit joining assembly materials for multi-layer lightning...

Details Circuit joining assembly materials for multi-layer lightning... Circuit joining assembly materials for multi-layer lightning...

2007-11-06

2010-11-09

Levi, Dameon E (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S002000, C174S255000, C174S250000, C361S212000, C361S218000

Reexamination Certificate

active

07829796

ABSTRACT:
An exemplary embodiment provides a multi-layer circuit joining assembly material configured to repair multi-layer flex circuits deployed on or in a composite surface as a lightning protection system. The multi-layer circuit joining assembly material includes a first conductive layer having a first end portion, a second conductive layer having a second end portion, and a dielectric material between the first conductive layer and the second conductive layer.

REFERENCES:
patent: 4715928 (1987-12-01), Hamby
patent: 5004639 (1991-04-01), Desai
patent: 5429326 (1995-07-01), Garesche et al.
patent: 6114050 (2000-09-01), Westre et al.
patent: 6841738 (2005-01-01), Michiwaki et al.
patent: 7223318 (2007-05-01), Rajabali
patent: 2006/0101754 (2006-05-01), Risi

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