Multilayer printed circuit board

Details Multilayer printed circuit board Multilayer printed circuit board

2007-06-04

2010-11-30

Dinh, Tuan T (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S263000, C174S264000, C361S765000, C361S766000, C361S795000

Reexamination Certificate

active

07842887

ABSTRACT:
A multilayer printed circuit board has an IC chip (20) included in a core substrate (30) in advance and a transition layer (38) provided on a pad (24) of the IC chip (20). Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the transition layer (38) made of copper on the die pad (24), it is possible to prevent resin residues on the pad (24) and to improve connection characteristics between the pad (24) and a via hole (60) and reliability.

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