Method of making multilayered circuitized substrate assembly

Details Method of making multilayered circuitized substrate assembly Method of making multilayered circuitized substrate assembly

2007-09-28

2010-11-02

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C174S262000

Reexamination Certificate

active

07823274

ABSTRACT:
A method of making a multilayered circuitized substrate assembly which includes bonding at least two circuitized substrates each including at least one layer of high temperature dielectric material, one of these layers in turn including at least one thru-hole therein having therein a quantity of a a low temperature conductive paste, the paste including an organic binder component and at least one metallic component. The flakes of the metallic component are sintered during the bonding to form a conductive path through the dielectric of one of the substrates.

REFERENCES:
patent: 5026624 (1991-06-01), Day et al.
patent: 5300402 (1994-04-01), Card, Jr. et al.
patent: 5891283 (1999-04-01), Tani et al.
patent: 6120708 (2000-09-01), Ohshita et al.
patent: 6528145 (2003-03-01), Berger et al.
patent: 6641898 (2003-11-01), Yazaki et al.
patent: 6762496 (2004-07-01), Yamamoto et al.
patent: 6809269 (2004-10-01), Fuller, Jr. et al.
patent: 6815837 (2004-11-01), Alcoe
patent: 6828514 (2004-12-01), Chan et al.
patent: 2002/0050586 (2002-05-01), Oshita et al.

Affiliated with

Also associated with

Rating

Method of making multilayered circuitized substrate assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making multilayered circuitized substrate assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making multilayered circuitized substrate assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4203750