Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2006-09-29
2010-06-08
Banks, Derris H (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S832000, C029S834000
Reexamination Certificate
active
07730610
ABSTRACT:
A mounting method comprising the steps of (A) disposing first liquid (2) on first region (11) provided on one principal surface of substrate (1); (B) bringing member-containing liquid (5) containing second liquid (3) and at least one member (4) into contact with the first liquid (2) disposed on the first region (11); and (C) removing the first liquid (2) and the second liquid (3) from the one principal surface to thereby dispose the member (4) on the first region (11). The first liquid (2) is substantially not dissolved in the second liquid (3). The wettability of the first liquid (2) with respect to the surface of the member (4) is higher than that of the second liquid (3).
REFERENCES:
patent: 6266872 (2001-07-01), Fjelstad
patent: 6417025 (2002-07-01), Gengel
patent: 6507989 (2003-01-01), Bowden et al.
patent: 6872645 (2005-03-01), Duan et al.
patent: 6969690 (2005-11-01), Zhou et al.
patent: 2002/0073536 (2002-06-01), Okuda et al.
patent: 2002/0151111 (2002-10-01), DiStefano et al.
patent: 2004/0009683 (2004-01-01), Hiraoka et al.
patent: 2004/0217003 (2004-11-01), Haba et al.
patent: 2004/0240109 (2004-12-01), Hamann et al.
patent: 2005/0070092 (2005-03-01), Kirby
patent: 2005/0164485 (2005-07-01), Onozawa
patent: 2006/0011712 (2006-01-01), Oggioni
patent: 1639841 (2005-07-01), None
patent: 2003-005212 (2003-01-01), None
patent: 2005-209939 (2005-08-01), None
patent: 2005-229042 (2005-08-01), None
patent: 2006-113258 (2006-04-01), None
patent: WO 03/081974 (2003-10-01), None
Drobac, S. “Fluidic Self-Assembly Could Change the Way FPDs Are Made”, Information Display, 1999, pp. 12-16.
Wang, D. et al. “Germanium nanowire field-effect transistors with SiO2and high-κ HfO2gate dielectrics”, Applied Physics Letters, vol. 83, No. 12, Sep. 22, 2003, pp. 2432-2434.
Huang, Y. et al. “Directed Assembly of One-Dimensional Nanostructures into Functional Networks”, Science, vol. 291, Jan. 26, 2001, pp. 630-633.
Lienemann, J. et al. “Modeling, Simulation, and Experimentation of a Promising New Packaging Technology: Parallel Fluidic Self-Assembly of Microdevices”, Sensor Update, vol. 13, 2004, pp. 3-43.
Srinivasan et al., “Microstructure to Substrate Self-Assembly Using Capillary Forces”, Journal of Microelectromechanical Systems, vol. 10, No. 1, Mar. 2001, pp. 17-24.
Scott et al., “High-Performance Inductors Using Capillary Based Fluidic Self-Assembly”, Joural of Microelectromechanical Systems, vol. 13, No. 2, Apr. 2004, pp. 300-309.
Nakagawa Tohru
Torii Hideo
Angwin David P
Banks Derris H
Hamre Schumann Mueller & Larson P.C.
Panasonic Corporation
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