Multilayer printed wiring board

Details Multilayer printed wiring board Multilayer printed wiring board

2006-04-11

2010-02-16

Lee, Jinhee J (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S792000

Reexamination Certificate

active

07663894

ABSTRACT:
Provided is a multilayer printed wiring board in which power supply patterns are shortened to decrease an impedance and electromagnetic radiation noise. The multilayer printed wiring board includes: a power supply layer (1) having at least two power supply patterns (5) with different voltages formed thereon; and a conductor layer (2) overlaid on the power supply layer (1) via an insulator, and at least one of the power supply patterns (5) has a first pattern portion (10) and a second pattern portion (11) formed in a non-contact manner with each other, and the first pattern portion (10) and the second pattern portion (11) are electrically connected to each other via a relay portion (14) including a relay pattern (12) formed on the conductor layer (2) and through holes (13) for connecting the power supply layer (1) and the conductor layer (2) at both ends of the relay pattern (12).

REFERENCES:
patent: 6782243 (2004-08-01), Shiotsu et al.
patent: 6797889 (2004-09-01), Delaporte
patent: 7030502 (2006-04-01), Chang
patent: 2003/0223208 (2003-12-01), Wu et al.
patent: 2004/0118602 (2004-06-01), Lee et al.
patent: 2002-374048 (2002-12-01), None

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