Phase change memory elements using self-aligned phase change...

Active solid-state devices (e.g. – transistors – solid-state diode – Bulk effect device – Bulk effect switching in amorphous material

Reexamination Certificate

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C257S002000, C257S003000, C257S005000, C257SE31131

Reexamination Certificate

active

07812334

ABSTRACT:
A phase change memory element and method of forming the same. The memory element includes a substrate supporting a first electrode. An insulating material element is positioned over the first electrode, and a phase change material layer is formed over the first electrode and surrounding the insulating material element such that the phase change material layer has a lower surface that is in electrical communication with the first electrode. The memory element also has a second electrode in electrical communication with an upper surface of the phase change material layer.

REFERENCES:
patent: 7348590 (2008-03-01), Happ
patent: 2003/0047762 (2003-03-01), Lowrey
patent: 2004/0124503 (2004-07-01), Harshfield
patent: 2005/0104231 (2005-05-01), Chiang et al.
patent: 2005/0212037 (2005-09-01), Pinnow et al.
patent: 2006/0006374 (2006-01-01), Chang
patent: 2006/0175599 (2006-08-01), Happ
patent: 2006/0208847 (2006-09-01), Lankhorst et al.
patent: 1 677 372 (2006-07-01), None
Notification of Transmittal of International Search Report and Written Opinion of the International Searching Authority Issued Oct. 31, 2007, copies of International Search Report and Written Opinion.

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