Method of manufacturing an inkjet head through the anodic...

Details Method of manufacturing an inkjet head through the anodic... Method of manufacturing an inkjet head through the anodic...

2008-07-07

2010-06-29

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C257SE21211

Reexamination Certificate

active

07745307

ABSTRACT:
In a method of manufacturing an inkjet head, a silicon dioxide (SiO2) layer is produced on the surface of first silicon member formed from single-crystal silicon. Next, a glass layer formed of borosilicate glass or the like is sputtered onto the surface of the silicon dioxide (SiO2) layer. A silicon oxide (SiOx, x<2) layer is then formed on the surface of a second silicon member. The first and second silicon members and are bonded together by applying heat at about 450° C. with heaters, as a DC voltage is applied across electrode terminals. As a result, a silicon dioxide (SiO2) layer is formed at the interface of the glass layer and silicon oxide (SiOx, x<2) layer, anodically bonding the two layers.

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