Method of manufacturing a substrate for a mini-UICC smart...

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Reexamination Certificate

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Reexamination Certificate

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07837122

ABSTRACT:
A method of producing a smart card having a reduced format in relation to a second standard format and an adapter with the second format, which is associated with the smart card. A card body has a zone for the extraction of the smart card and a zone for the extraction of the adapter. At least the smart card is extracted from the support. The smart card is extracted from a zone located outside the peripheral outline of the adapter extraction zone. The invention also relates to the support thus obtained.

REFERENCES:
patent: 4639585 (1987-01-01), Haghiri-Tehrani et al.
patent: 4764803 (1988-08-01), Ueda
patent: 5362955 (1994-11-01), Haghiri-Tehrani
patent: 5581065 (1996-12-01), Nishikawa et al.
patent: 5936227 (1999-08-01), Truggelmann et al.
patent: 6028774 (2000-02-01), Shin et al.
patent: 6065681 (2000-05-01), Trueggelmann
patent: 6372541 (2002-04-01), Bouchez et al.
patent: 6448638 (2002-09-01), Fidalgo et al.
patent: 6561432 (2003-05-01), Vedder et al.
patent: 6653565 (2003-11-01), Kashima
patent: 6685097 (2004-02-01), Housse
patent: 6964377 (2005-11-01), Haghiri et al.
patent: 7183636 (2007-02-01), Boccia et al.
patent: 7597250 (2009-10-01), Finn
patent: 2002/0160630 (2002-10-01), Kashima
patent: 2009/0040695 (2009-02-01), Fidalgo et al.
patent: 298 19 389 (1999-11-01), None
patent: 2 778 002 (1999-10-01), None
International Search Report dated Feb. 1, 2006.

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